EDA tools

Cadence, Synopsys and Siemens are all promoting agentic AI in their chip design tools for 2026, pitching autonomous AI engineers that can carry out design work with limited human oversight. Tom's Hardware examines how far these capabilities have actually progressed across the three major electronic design automation vendors, and what the shift means for semiconductor engineering teams.

Synopsys and OpenAI have announced a revenue-sharing arrangement covering chips designed with AI tools. The deal links the semiconductor design software company with the leading AI lab, with revenue split from chips created using AI-assisted design processes. It highlights the growing role of artificial intelligence in chip development and signals closer ties between EDA software providers and AI companies.

TSMC has introduced an AI Design Kit aimed at supporting semiconductor design with agentic AI, providing assistance at the process technology level. The kit is intended to help designers use AI agents within TSMC's manufacturing process frameworks. Details on partners, availability and specific tool integrations remain limited in the initial report.

Reports describe how artificial intelligence is increasingly used to design computer chips, with AI assisting at every stage of semiconductor development, from electronic design automation software to automated layout and verification. OpenAI's internal chip effort, referred to as Jalapeño, is cited as an example of AI-driven silicon design, marking a shift toward chips largely designed by machines.