HBM

Samsung is expected to more than double its production of HBM4 and HBM4E high-bandwidth memory DRAM next year, according to a report citing sources. The expansion targets surging demand for advanced memory used in AI accelerators, where Samsung competes with SK Hynix and Micron for supply deals with chip and data-center customers.

Industry observers are asking when the global memory chip shortage will ease. The squeeze is driven by surging AI infrastructure demand, limited wafer capacity, and the priority given to HBM production, while DRAM and NAND investment remains constrained. New manufacturing capacity takes years to build, so analysts say relief is unlikely before major fabs now under construction come online.

SK hynix is considering producing memory chips in the United States, according to the Korea Herald. The South Korean chipmaker, a leading supplier of HBM and DRAM to companies like Nvidia, has so far concentrated manufacturing in Korea and China. A US move would align with Washington's push to bring advanced semiconductor production onshore through incentives and tariffs, though the company has reportedly not made a final decision.

Jensen Huang has reportedly committed to doubling chip supply, a move that would lock up roughly 37% of the world's high-bandwidth memory (HBM) output for 2026. The pledge underscores Nvidia's aggressive push to secure memory for its AI accelerators amid shortages, leaving rival chipmakers competing for the remaining HBM capacity from suppliers like SK Hynix, Samsung and Micron.

Micron is being discussed as a key beneficiary of the AI boom, with attention focused on its memory chips used in AI data centres. The discussion centres on investment insights into whether the company's HBM and DRAM business can keep growing as demand for AI hardware accelerates.