ICF

Qualcomm has taken a license covering Huawei's LogicFolding chip technology patents, according to a Bloomberg report. The agreement means the US chipmaker can use Huawei's innovations in advanced chip design despite the ongoing US-China technology rivalry. Industry watchers say the deal signals that cross-border semiconductor patent licensing continues even as Washington restricts exports of advanced chips to Chinese firms, and that Huawei's chip research remains commercially valuable.

Reports say Qualcomm has allied with Huawei around chip technology, with the LogicFolding development highlighted for its potential impact on the global semiconductor industry. The news is drawing attention because it links two companies at the center of US-China tech tensions, and any cooperation between them could reshape supply chains and competition in chip design and manufacturing worldwide.