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Xerox PARC

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    Researchers at Xerox PARC developed a semiconductor chip designed to break apart instantly on command, a self-destruct capability aimed at protecting sensitive data in military and security applications. The work, funded in part by DARPA, used tempered glass substrates so the chip could be triggered remotely to disintegrate. Resurfaced discussions are revisiting how far such disposable electronics technology has come since the 2015 demonstration.