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Nvidia shows co-packaged optics prototype at SEMICON West
Original: Nvidia unveiled a prototype of its Optics-on-Interposer co-packaged optics technology at SEMICON West 2026. Source: Digi
Nvidia has unveiled a prototype of its Optics-on-Interposer co-packaged optics technology at SEMICON West 2026. The technology, reported by DigiTimes Asia, is aimed at improving data transfer between chips in AI data centre systems by using optical interconnects, cutting power consumption compared with traditional copper links. The semiconductor industry is watching closely as co-packaged optics becomes a key battleground for next-generation AI infrastructure.
Why now: Co-packaged optics is seen as a critical next step for scaling AI data centres, and Nvidia's prototype signals where its hardware roadmap is heading
Evidence
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