Mmastodon TechnologySemiconductors first seen 1 d ago, last 4 min ago, peak #2

ASE Technology lifts capex as AI packaging demand surges

Original: Advanced packaging, not silicon supply, is the true bottleneck for AI hardware. Taiwan’s ASE Technology just pushed its

Taiwan's ASE Technology raised its 2026 LEAP revenue forecast above $4 billion and increased capital expenditure to $11.5 billion, racing to expand advanced packaging capacity. The company argues that packaging, not silicon wafer supply, is the real bottleneck for AI hardware, as chipmakers struggle to secure backend capacity for AI accelerators.

Why now: ASE's sharply higher spending forecast highlights how advanced packaging has become the constraint on AI chip output.

ASE TechnologyTaiwan

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• Advanced packaging, not silicon supply, is the true bottleneck for AI hardware. Taiwan’s ASE Technology just pushed its 2026 LEAP revenue forecast past $4 billion and hiked capital expenditure to $11.5 billion, racing to build plant capacity before backend packaging demand… · asiaai · 1

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