✉news SciencePhysics first seen 1 d ago, last 1 d ago, peak #25

Laser technique slices large-area diamond substrates

Original: Laser slicing of large-area diamond substrates

Researchers report a laser-based method for slicing large-area diamond substrates, a step long sought by the electronics and optics communities. Diamonds are prized for heat dissipation and quantum applications, but cutting them without cracking has limited wafer sizes. The new approach promises cleaner separation of thin diamond slices, potentially easing production of diamond-based power devices and sensors. Details of the study were announced via a research news release.

Why now: New research on processing diamond wafers matters for semiconductor and quantum device manufacturing.

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• Laser slicing of large-area diamond substrates · EurekAlert!

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