Mmastodon TechnologySemiconductors first seen 5 h ago, last 13 min ago, peak #8
'Logic folding' dismissed as repackaged die stacking
Original: What am I misunderstanding? "Logic folding" and "tau law" are just die stacking. They don't change the statistics behind
A debate is circulating in semiconductor circles over Huawei's use of the terms 'logic folding' and 'tau law', which one critic argues are simply die stacking under new names. The argument: these techniques connect chiplets more neatly but do not change the underlying statistics of machine learning performance or manufacturing yields, calling into question how much genuine innovation the branding represents.
Why now: Huawei's marketing terminology for its chip packaging advances is being challenged as overstated.
Rank over time, top of the chart is #1. 5 snapshots from 5 h ago to 13 min ago.
Evidence
API: https://socialmediatrends-api.osmike.com/v1/trends/793357