Mmastodon TechnologySemiconductors first seen 19 h ago, last 15 min ago, peak #3

SK hynix and Samsung push 16-layer HBM4 chips for AI

Original: SK hynix and Samsung are advancing 16-layer HBM4 technology while Nvidia's Vera Rubin AI platform is expected to rely la

SK hynix and Samsung are developing 16-layer HBM4 high-bandwidth memory technology as competition in the AI chip supply chain intensifies. Meanwhile, Nvidia's upcoming Vera Rubin AI platform is expected to rely largely on 12-layer high-bandwidth memory chips. The development highlights Korean chipmakers' push to stay ahead in next-generation memory as demand for AI hardware accelerates.

Why now: Memory makers are racing to supply next-generation chips for Nvidia's AI platforms, a key development in the global AI hardware race.

SK hynixSamsungNvidiaVera Rubin platform

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• SK hynix and Samsung are advancing 16-layer HBM4 technology while Nvidia's Vera Rubin AI platform is expected to rely largely on 12-layer high-bandwidth memory chips. Source: The Korea Herald https://www. koreaherald.com/article/108977 51 # Semiconductors # Samsung # Nvidia · sipirtu · 1

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