Mmastodon TechnologySemiconductors first seen 1 d ago, last 18 min ago, peak #3

SK hynix and Samsung push 16-layer HBM4 chips for Nvidia's next AI platform

Original: SK hynix and Samsung are advancing 16-layer HBM4 technology while Nvidia's Vera Rubin AI platform is expected to rely la

South Korean chipmakers SK hynix and Samsung are advancing 16-layer HBM4 high-bandwidth memory technology as Nvidia prepares its next-generation Vera Rubin AI platform. According to The Korea Herald, the new platform is expected to rely largely on 12-layer HBM chips, meaning the more advanced 16-layer memory may come into play in later product generations. The development underscores the fierce race between Korean memory makers to supply Nvidia's rapidly growing AI chip business.

Why now: Nvidia's next AI platform's memory requirements will shape the competition between Korean chipmakers for a key supplier role.

SK hynixSamsungNvidiaVera Rubin

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• SK hynix and Samsung are advancing 16-layer HBM4 technology while Nvidia's Vera Rubin AI platform is expected to rely largely on 12-layer high-bandwidth memory chips. Source: The Korea Herald https://www. koreaherald.com/article/108977 51 # Semiconductors # Samsung # Nvidia · sipirtu · 1

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